The 4 channels Tx TGV optoelectronic interposer chip realizes glass-based signal transmission through laser-induced and deep silicon etching technologies. By utilizing the redistribution layer (RDL) and micro-bumping processes, it achieves a wiring bandwidth of over 110GHz, significantly improving the signal transmission efficiency and density. It matches the mainstream four-channel silicon photonic modulation chips and electrical driver chips to realize a 4-channel standardized TGV interposer solution. Meanwhile, it is compatible with the pin definitions of mainstream silicon photonic chips and electrical chips, and supports 2.5D/3D stacking and packaging technologies to achieve a high degree of integration in optoelectronic hybrid packaging. On the chip, it can integrate the laser direct writing optical waveguide and the internal slotting of the interposer, realizing low-loss and high-density optical path fan-in and fan-out.