TRx TGV optoelectronic interposer chip realizes glass-based signal switching through laser induction and deep silicon etching, and uses redistribution layer (RDL) and micro-bump technology to achieve a wiring bandwidth of more than 110GHz, significantly improving signal transmission efficiency and density; matching mainstream four-channel silicon photonic modulation chip, electric driver chip and transimpedance amplifier chip to achieve a 4-channel standardized solution, while being compatible with the pin definitions of mainstream silicon photonic chips and electric chips, achieving high integration of optoelectronic hybrid packaging; laser direct writing optical waveguides and interposer internal slots can be integrated on the chip to achieve low-loss and high-density optical path fan-in and fan-out.