The TGVI high-speed T/ROSA optoelectronic (OE) product leverages Deep Optics Valley’s proprietary TGV optoelectronic interposer chip, integrating laser-induced deep silicon etching, redistribution layer (RDL) patterning, and micro-bumping processes to enable optoelectronic chip packaging interconnection and signal conversion on glass substrates. The self-developed TGV interposer chip delivers a wiring bandwidth exceeding 110 GHz, significantly enhancing signal transmission efficiency and density through optimized interconnect architecture. Designed for compatibility with mainstream silicon photonic modulation chips and electrical driver ICs, the solution enables seamless integration of 4/8-channel standardized packages. It adheres to industry-standard pin definitions for silicon photonic and electrical chips, facilitating high-density optoelectronic hybrid packaging with minimized interconnection complexity.On-chip integration of laser-direct-written waveguides and interposer-integrated grooving structures supports low-loss coupling with FAU (fiber array units), MT ferrules, and multi-core fibers (MCF), enabling high-density optical fan-in/fan-out for advanced photonic packaging applications.